MediaTek Dimensity 7000 Leaks Before Launch: What We Know So Far

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After MediaTek unveiled the flagship Dimensity 9000 chip earlier this week, rumors are already circulating for the company’s next chip, which is expected to be an upper midrange Dimensity 7000.

According to the leaks, the MediaTek Dimensity 7000 could be more powerful than the popular Snapdragon 870, at least in some aspects like support for fast charging. It could be somewhere between the Snapdragon 870 and the flagship Snapdragon 888 with support for fast charging around 75 W.

The report of Digital discussion station, a well-known tipster on the Chinese micro-blogging platform Weibosuggests that the Dimensity 7000 has already entered the testing phase, hinting at a launch in the near future.

The chip is also said to be based on TSMC’s 5nm manufacturing process, and just like the more powerful Dimensity 9000, it uses the new ARM V9 architecture.

What about the performance of the Dimensity 7000?

Not much is currently known about the performance of the chip, and we may have to wait a little longer for details like clock speed. However, judging by the name of the chipset, we would expect it to fall into the high-end segment, where the Dimensity 7000 could potentially replace the company’s 6nm chipsets like the Dimensity 1200.

The fact that MediaTek skipped a lot of numbers to get to 9000 and the rumored 7000 suggests that we might see a number of midrange chipsets in the future that could occupy the middle numbers. All of these chips could be more powerful than the Dimensity 1200.

However, these are only speculations from our point of view at this time, and we’ll have to wait for official information on future chipsets to be sure.


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